Chercheur postdoctoral en nanoimagerie à rayons X pour la métrologie semi-conducteur — EPFL
- Lieu
- Villigen
- Contrat
- full-time
- Publié
- Hier
Vue d’ensemble du poste
Mission
The performance of X-ray microscopy has improved significantly over the last decade, enabling synchrotron-based X-ray imaging to resolve individual transistors in modern semiconductor devices.
As the industry moves to 3D transistor architectures and stacked, hybrid-bonded devices, non-destructive, high-resolution 3D imaging is becoming a necessity.
- Mission
- The performance of X-ray microscopy has improved significantly over the last decade, enabling synchrotron-based X-ray imaging to resolve individual transistors in modern semiconductor devices.
- Main duties and responsibilities
- You will develop an acquisition and reconstruction framework that uses the known geometry, composition, and layout regularity of semiconductor devices as prior information to detect deeply buried defects from the smallest possible number of X-ray measurements.
Responsabilités principales
- Main duties and responsibilities
- You will develop an acquisition and reconstruction framework that uses the known geometry, composition, and layout regularity of semiconductor devices as prior information to detect deeply buried defects from the smallest possible number of X-ray measurements.
- Our pipeline reconstructs each projection from thousands of diffraction patterns, followed by volume reconstruction from projections measured at many rotation angles.
- These are two inverse problems, each with its own sampling requirements. The questions we want to answer:
- What is the minimum number of diffraction patterns and projections needed to identify a defect?
- Can we detect defects from diffraction patterns alone, bypassing projection reconstruction?
- Can we reliably identify defects without ever resolving them?
- What is the best way to incorporate the known design information into the imaging process?
- The primary focus will be on algorithm development, followed by their demonstration at synchrotron experiments.
- You will start working with real already existing experimental datasets and will have the opportunity to extend our established reconstruction pipeline, and integrate with new data acquisition methods.
Processus de candidature
- Unfortunately, current 3D X-ray nanoimaging methods are prohibitively slow for practical semiconductor metrology and inspection applications.
- Unlike most samples placed under a microscope, microchips are manufactured objects that follow strict design rules.
- This allows us to shift from the standard imaging question of "what is the structure of this sample?" to "how does the structure differ from the known design?".
- The second question can be answered with far fewer measurements than the first.
- The newly established Laboratory for Nanoscale X-ray Metrology is looking for a motivated postdoctoral researcher to turn this idea into a working method.
- This is one of two postdoctoral positions opening in the group.
- This position focuses on high-throughput imaging of static structural defects, while the companion position focuses on time-resolved imaging of dynamic processes.
- Each postdoc will lead their own independent research direction, with an opportunity for close collaborative work.
Détails supplémentaires
- These are two inverse problems, each with its own sampling requirements. The questions we want to answer:
- You will also get a chance to perform experiments at the cSAXS beamline of the upgraded Swiss Light Source synchrotron, as well as other facilities around the world. We are looking for a person with:
- Semiconductor devices or metrology.
Notes et contenu original
- These are two inverse problems, each with its own sampling requirements.
- The questions we want to answer:
- You will also get a chance to perform experiments at the cSAXS beamline of the upgraded Swiss Light Source synchrotron, as well as other facilities around the world.
- We are looking for a person with:
Questions sur cette offre
Quel salaire propose EPFL pour ce poste ?
EPFL indique CHF 62 000 - 94 000 bruts par an pour ce poste à Villigen. Il s'agit du salaire publié dans l'annonce d'origine (ou, si l'employeur ne précise pas de montant, d'une estimation réaliste pour le rôle et le secteur) — le calculateur de ce site le convertit en net réel une fois l'impôt frontalier et les cotisations sociales appliqués.
Est-ce un poste à temps plein, et quel type de contrat propose EPFL ?
Cette offre est un poste en temps plein. Le type de contrat affiché ici provient directement de l'annonce originale de l'employeur ; confirmez toujours les horaires exacts, le préavis et la durée d'essai avec EPFL pendant le processus de candidature, ces détails pouvant varier même au sein de la même catégorie de contrat.
Ai-je besoin d'un permis de frontalier pour un poste dans le canton de Argovie ?
Les résidents UE/AELE domiciliés dans la zone frontalière du pays voisin du canton de Argovie peuvent demander un permis G ; l'employeur suisse le dépose auprès de l'office cantonal des migrations après signature du contrat. Les règles de zone frontalière et les délais varient selon le pays voisin et le canton — confirmez les détails auprès de l'office des migrations du canton de Argovie ou avec les RH pendant la candidature.
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